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高温无尘无氧烤箱HCM-100系列

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晶圆级PI胶工艺烘箱

Product Description: wafer level PI glue process oven

内部净化等级可达Class100

The internal purification level can reach class100

内腔无氧设计,满足20PPM以下的氧浓度需求

The oxygen free design of the inner cavity can meet the oxygen concentration requirements below 20ppm

支持SECS/GEM自动联机需求

Support SECS/GEM automatic online requirements

 

 

  

 

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无尘等级:Class 100;

Parameters: dust free grade: Class 100;

含氧量:<=20ppm (动态监控);

Oxygen content: < = 20ppm (dynamic monitoring);

温度范围: +60~ +500°C;

 Temperature range: + 60 ~ + 500 ° C;

温度均匀度:±1.5% (空载) ;

Temperature uniformity: ± 1.5% (no load);

升温速度:常温~+400°C,升温速率 > 6°C/min;

Heating rate: room temperature ~ + 400 ° C, heating rate > 6 ° C / min;

降温速度:夹层降温装置,平均速率 5℃/min以内;

Cooling rate: sandwich cooling device, the average rate is less than 5 ℃ / min;

降温斜率可设定,1.5h可从375℃ 降温到80℃;

The cooling slope can be set, and the temperature can be reduced from 375 ℃ to 80 ℃ in 1.5 h;

温度过冲:<2℃@200℃,<3℃@300℃;

Temperature overshoot: < 2 ℃ @ 200 ℃, < 3 ℃ @ 300 ℃;

温控精度:±1°C (空载);

Temperature control accuracy: ± 1 ° C (no load);

工作腔尺寸: W966 mm×H715 mm×D588 mm;

Working chamber size: w966 mm × H715 mm × D588 mm;  

Single chamber;

外形尺寸:W1910 mm×H1930 mm×D1037 mm;

Overall dimension: w1910 mm × H1930 mm × D1037 mm;

烘箱搁板为活动式,共两片, 搁板承重≥30kg;

The drying oven shelf is movable, with two pieces in total, and the shelf load is more than or equal to 30kg;

加热功率:18KW;

Heating power: 18kw;

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